Through Fabric: A Cross-world Thermal Covert Channel on TEE-enhanced FPGA-MPSoC Systems

Hassan Nassar, Jeferson Gonzalez-Gomez, Varun Manjunath, Lars Bauer, Jorg Henkel

Producción científica: Capítulo del libro/informe/acta de congresoContribución a la conferenciarevisión exhaustiva

Resumen

The ever-evolving computing landscape gets more complex in every moment and the need for heterogeneous compute systems becomes more relevant. As the usability of such systems grew, finding methods for securing them became more relevant. Commercial vendors already introduced Trusted Execution Environments (TEEs) for those systems. TEEs serve the need for isolation, where sensitive data are processed in a secure world, and non-trusted applications are executed in the normal world. In this paper, we introduce Through Fabric: a novel attack against TEE-enhanced FPGA-MPSoCs. We show that existing benign hardware accelerators can be manipulated from the secure world to implement a temperature-based covert channel. We successfully run this attack on a commercial FPGA-MPSoC within the OP-TEE environment without additional access rights. We use an open-source implementation of AES for the accelerator and we reach a transmission speed of 2 bits per second with bit error rate of 1.9% and packet error rate of 4.3%. We are the first to show that a TEE can be bypassed on FPGA-MPSoCs via temperature-based covert channel communication.

Idioma originalInglés
Título de la publicación alojadaASP-DAC 2025 - 30th Asia and South Pacific Design Automation Conference, Proceedings
EditorialInstitute of Electrical and Electronics Engineers Inc.
Páginas461-467
Número de páginas7
ISBN (versión digital)9798400706356
DOI
EstadoPublicada - 4 mar 2025
Evento30th Asia and South Pacific Design Automation Conference, ASP-DAC 2025 - Tokyo, Japón
Duración: 20 ene 202523 ene 2025

Serie de la publicación

NombreProceedings of the Asia and South Pacific Design Automation Conference, ASP-DAC
ISSN (versión impresa)2153-6961
ISSN (versión digital)2153-697X

Conferencia

Conferencia30th Asia and South Pacific Design Automation Conference, ASP-DAC 2025
País/TerritorioJapón
CiudadTokyo
Período20/01/2523/01/25

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