Validation and application of physics-based via models to dense via arrays

Xiaoxiong Gu; Young Kwark; Yao Jiang Zhang; Jim Fan; Albert Ruehli; Miroslav Kotzev; Sebastian Müller; Renato Rimolo-Donadio; Christian Schuster; Bruce Archambeault

Validation and application of physics-based via models to dense via arrays

Xiaoxiong Gu
, Young Kwark
, Yao Jiang Zhang
, Jim Fan
, Albert Ruehli
, Miroslav Kotzev
, Sebastian Müller
, Renato Rimolo-Donadio
, Christian Schuster
, Bruce Archambeault

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review

6 Scopus citations

Abstract

Fast and accurate via models are required to analyze dense via arrays on printed circuit boards with pitches up to 1mm. Fundamentals of physics-based via models are reviewed and their advantages over general-purpose electromagnetic field solvers are discussed. Recent studies extend the models to take into account multiple scattering among vias. This paper also analyzes if anisotropic field distribution on via holes, and boundary reflection due to the finite size of power planes play a role for high speed digital designs. The updated via models are validated by hardware measurement and 3D full-wave simulations.

Original language	English
Title of host publication	DesignCon 2011
Pages	1031-1051
Number of pages	21
State	Published - 2011
Externally published	Yes
Event	DesignCon 2011 - Santa Clara, CA, United States Duration: 31 Jan 2011 → 3 Feb 2011

Publication series

Name	DesignCon 2011
Volume	2

Conference

Conference	DesignCon 2011
Country/Territory	United States
City	Santa Clara, CA
Period	31/01/11 → 3/02/11

Cite this

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title = "Validation and application of physics-based via models to dense via arrays",

abstract = "Fast and accurate via models are required to analyze dense via arrays on printed circuit boards with pitches up to 1mm. Fundamentals of physics-based via models are reviewed and their advantages over general-purpose electromagnetic field solvers are discussed. Recent studies extend the models to take into account multiple scattering among vias. This paper also analyzes if anisotropic field distribution on via holes, and boundary reflection due to the finite size of power planes play a role for high speed digital designs. The updated via models are validated by hardware measurement and 3D full-wave simulations.",

author = "Xiaoxiong Gu and Young Kwark and Zhang, \{Yao Jiang\} and Jim Fan and Albert Ruehli and Miroslav Kotzev and Sebastian M{\"u}ller and Renato Rimolo-Donadio and Christian Schuster and Bruce Archambeault",

year = "2011",

language = "Ingl{\'e}s",

isbn = "9781617824784",

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AU - Gu, Xiaoxiong

AU - Kwark, Young

AU - Zhang, Yao Jiang

AU - Fan, Jim

AU - Ruehli, Albert

AU - Kotzev, Miroslav

AU - Müller, Sebastian

AU - Rimolo-Donadio, Renato

AU - Schuster, Christian

AU - Archambeault, Bruce

PY - 2011

Y1 - 2011

N2 - Fast and accurate via models are required to analyze dense via arrays on printed circuit boards with pitches up to 1mm. Fundamentals of physics-based via models are reviewed and their advantages over general-purpose electromagnetic field solvers are discussed. Recent studies extend the models to take into account multiple scattering among vias. This paper also analyzes if anisotropic field distribution on via holes, and boundary reflection due to the finite size of power planes play a role for high speed digital designs. The updated via models are validated by hardware measurement and 3D full-wave simulations.

AB - Fast and accurate via models are required to analyze dense via arrays on printed circuit boards with pitches up to 1mm. Fundamentals of physics-based via models are reviewed and their advantages over general-purpose electromagnetic field solvers are discussed. Recent studies extend the models to take into account multiple scattering among vias. This paper also analyzes if anisotropic field distribution on via holes, and boundary reflection due to the finite size of power planes play a role for high speed digital designs. The updated via models are validated by hardware measurement and 3D full-wave simulations.

UR - https://www.scopus.com/pages/publications/84866382276

M3 - Contribución a la conferencia

AN - SCOPUS:84866382276

SN - 9781617824784

T3 - DesignCon 2011

SP - 1031

EP - 1051

BT - DesignCon 2011

T2 - DesignCon 2011

Y2 - 31 January 2011 through 3 February 2011

ER -

Validation and application of physics-based via models to dense via arrays

Abstract

Publication series

Conference

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