The viability of 25 Gb/s on-board signalling

Mark B. Ritter; Petar Pepeljugoski; Xiaoxiong Gu; Young Kwark; Dong Kam; Renato Rimolo-Donadio; Boping Wu; Christian Baks; Richard John; Lei Shan; Christian Schuster

doi:10.1109/ECTC.2008.4550116

The viability of 25 Gb/s on-board signalling

Mark B. Ritter
, Petar Pepeljugoski
, Xiaoxiong Gu
, Young Kwark
, Dong Kam
, Renato Rimolo-Donadio
, Boping Wu
, Christian Baks
, Richard John
, Lei Shan
, Christian Schuster

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review

4 Scopus citations

Abstract

What package improvements are required for dense, high aggregate bandwidth buses running at data rates beyond 10 Gb/s per pin, and when might optical interconnects on the board be required? We present a study of distance and speed limits for electrical on-board module-to-module links with an eye to answering these questions. Detailed electrical link models have been validated with active, high-speed differential bus measurements utilizing a 16-channel link chip with programmable equalization and a per-channel data rate of up to 11 Gb/s. Electrical signalling limits were then determined by extrapolating our models to higher speeds, and these limits were compared to the results of work on on-board optical interconnects.

Original language	English
Title of host publication	2008 Proceedings 58th Electronic Components and Technology Conference, ECTC
Pages	1121-1127
Number of pages	7
DOIs	https://doi.org/10.1109/ECTC.2008.4550116
State	Published - 2008
Externally published	Yes
Event	2008 58th Electronic Components and Technology Conference, ECTC - Lake Buena Vista, FL, United States Duration: 27 May 2008 → 30 May 2008

Publication series

Name	Proceedings - Electronic Components and Technology Conference
ISSN (Print)	0569-5503

Conference

Conference	2008 58th Electronic Components and Technology Conference, ECTC
Country/Territory	United States
City	Lake Buena Vista, FL
Period	27/05/08 → 30/05/08

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10.1109/ECTC.2008.4550116

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Ritter, M. B., Pepeljugoski, P., Gu, X., Kwark, Y., Kam, D., Rimolo-Donadio, R., Wu, B., Baks, C., John, R., Shan, L., & Schuster, C. (2008). The viability of 25 Gb/s on-board signalling. In 2008 Proceedings 58th Electronic Components and Technology Conference, ECTC (pp. 1121-1127). Article 4550116 (Proceedings - Electronic Components and Technology Conference). https://doi.org/10.1109/ECTC.2008.4550116

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title = "The viability of 25 Gb/s on-board signalling",

abstract = "What package improvements are required for dense, high aggregate bandwidth buses running at data rates beyond 10 Gb/s per pin, and when might optical interconnects on the board be required? We present a study of distance and speed limits for electrical on-board module-to-module links with an eye to answering these questions. Detailed electrical link models have been validated with active, high-speed differential bus measurements utilizing a 16-channel link chip with programmable equalization and a per-channel data rate of up to 11 Gb/s. Electrical signalling limits were then determined by extrapolating our models to higher speeds, and these limits were compared to the results of work on on-board optical interconnects.",

author = "Ritter, \{Mark B.\} and Petar Pepeljugoski and Xiaoxiong Gu and Young Kwark and Dong Kam and Renato Rimolo-Donadio and Boping Wu and Christian Baks and Richard John and Lei Shan and Christian Schuster",

year = "2008",

doi = "10.1109/ECTC.2008.4550116",

language = "Ingl{\'e}s",

isbn = "9781424422302",

series = "Proceedings - Electronic Components and Technology Conference",

pages = "1121--1127",

booktitle = "2008 Proceedings 58th Electronic Components and Technology Conference, ECTC",

note = "2008 58th Electronic Components and Technology Conference, ECTC ; Conference date: 27-05-2008 Through 30-05-2008",

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Ritter, MB, Pepeljugoski, P, Gu, X, Kwark, Y, Kam, D, Rimolo-Donadio, R, Wu, B, Baks, C, John, R, Shan, L & Schuster, C 2008, The viability of 25 Gb/s on-board signalling. in 2008 Proceedings 58th Electronic Components and Technology Conference, ECTC., 4550116, Proceedings - Electronic Components and Technology Conference, pp. 1121-1127, 2008 58th Electronic Components and Technology Conference, ECTC, Lake Buena Vista, FL, United States, 27/05/08. https://doi.org/10.1109/ECTC.2008.4550116

The viability of 25 Gb/s on-board signalling. / Ritter, Mark B.; Pepeljugoski, Petar; Gu, Xiaoxiong et al.
2008 Proceedings 58th Electronic Components and Technology Conference, ECTC. 2008. p. 1121-1127 4550116 (Proceedings - Electronic Components and Technology Conference).

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review

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AU - Rimolo-Donadio, Renato

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AU - Baks, Christian

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AU - Shan, Lei

AU - Schuster, Christian

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N2 - What package improvements are required for dense, high aggregate bandwidth buses running at data rates beyond 10 Gb/s per pin, and when might optical interconnects on the board be required? We present a study of distance and speed limits for electrical on-board module-to-module links with an eye to answering these questions. Detailed electrical link models have been validated with active, high-speed differential bus measurements utilizing a 16-channel link chip with programmable equalization and a per-channel data rate of up to 11 Gb/s. Electrical signalling limits were then determined by extrapolating our models to higher speeds, and these limits were compared to the results of work on on-board optical interconnects.

AB - What package improvements are required for dense, high aggregate bandwidth buses running at data rates beyond 10 Gb/s per pin, and when might optical interconnects on the board be required? We present a study of distance and speed limits for electrical on-board module-to-module links with an eye to answering these questions. Detailed electrical link models have been validated with active, high-speed differential bus measurements utilizing a 16-channel link chip with programmable equalization and a per-channel data rate of up to 11 Gb/s. Electrical signalling limits were then determined by extrapolating our models to higher speeds, and these limits were compared to the results of work on on-board optical interconnects.

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ER -

The viability of 25 Gb/s on-board signalling

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