TY - GEN
T1 - Simulation of via interconnects using physics-based models and microwave network parameters
AU - Rimolo-Donadio, Renato
AU - Stepan, Andrzej J.
AU - Brüns, Heinz Dietrich
AU - Drewniak, James L.
AU - Schuster, Christian
PY - 2008
Y1 - 2008
N2 - In this paper, the simulation of via interconnects in multilayered printed circuit boards (PCBs) and packages combining physics-based via models and microwave network theory will be discussed. The description of the via in terms of network parameters, partitioning of the system, and combination of partial results will be addressed. Two alternatives to combine the results are compared, namely multiplication of ABCD matrices and the segmentation method based on S-parameters. The goal of this work is to develop a fast and accurate modeling strategy for via arrays in the multi-Gigabit range, extensible to an arbitrary number of elements, and suitable for automation and design optimization. The obtained results show good agreement with respect to 3D electromagnetic field simulations and measurements up to 20 GHz. Hence, this approach is a promising technique for efficient system-level simulation of interconnects.
AB - In this paper, the simulation of via interconnects in multilayered printed circuit boards (PCBs) and packages combining physics-based via models and microwave network theory will be discussed. The description of the via in terms of network parameters, partitioning of the system, and combination of partial results will be addressed. Two alternatives to combine the results are compared, namely multiplication of ABCD matrices and the segmentation method based on S-parameters. The goal of this work is to develop a fast and accurate modeling strategy for via arrays in the multi-Gigabit range, extensible to an arbitrary number of elements, and suitable for automation and design optimization. The obtained results show good agreement with respect to 3D electromagnetic field simulations and measurements up to 20 GHz. Hence, this approach is a promising technique for efficient system-level simulation of interconnects.
UR - https://www.scopus.com/pages/publications/51849150952
U2 - 10.1109/SPI.2008.4558352
DO - 10.1109/SPI.2008.4558352
M3 - Contribución a la conferencia
AN - SCOPUS:51849150952
SN - 9781424423187
T3 - 12th IEEE Workshop on Signal Propagation on Interconnects, SPI
BT - 12th IEEE Workshop on Signal Propagation on Interconnects, SPI
T2 - 12th IEEE Workshop on Signal Propagation on Interconnects, SPI
Y2 - 12 May 2008 through 15 May 2008
ER -