Signal integrity: Efficient, physicsbased via modeling: Principles and methods

Renato Rimolo-Donadio; Sebastian Müller; Xiaomin Duan; Miroslav Kotzev; Heinz D. Brüns; Christian Schuster

doi:10.1109/MEMC.2012.6244946

Signal integrity: Efficient, physicsbased via modeling: Principles and methods

Renato Rimolo-Donadio
, Sebastian Müller
, Xiaomin Duan
, Miroslav Kotzev
, Heinz D. Brüns
, Christian Schuster

Hamburg University of Technology

Research output: Contribution to specialist publication › Article

10 Scopus citations

Abstract

This article discusses the high-frequency behavior of thru-hole vias enclosed by solid reference planes in packages and printed circuit boards and reviews some efficient modeling alternatives for signal and power integrity applications. The electromagnetic behavior of vias, including the excitation of parallel-plate modes and the role of return vias, is introduced as preamble to the modeling approaches. The physics-based via model and its building blocks are then discussed. The last section reviews some improvements to the via model, covering intrinsic models for the near field of vias and the utilization of contour integral and multiple scattering methods.

Original language	English
Pages	55-61
Number of pages	7
Volume	1
No	1
Specialist publication	IEEE Electromagnetic Compatibility Magazine
DOIs	https://doi.org/10.1109/MEMC.2012.6244946
State	Published - 1 Mar 2012
Externally published	Yes

Keywords

Parallel plates
Physics-based
Power distribution network
Printed circuit board
Signal and power integrity
Vias

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10.1109/MEMC.2012.6244946

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title = "Signal integrity: Efficient, physicsbased via modeling: Principles and methods",

abstract = "This article discusses the high-frequency behavior of thru-hole vias enclosed by solid reference planes in packages and printed circuit boards and reviews some efficient modeling alternatives for signal and power integrity applications. The electromagnetic behavior of vias, including the excitation of parallel-plate modes and the role of return vias, is introduced as preamble to the modeling approaches. The physics-based via model and its building blocks are then discussed. The last section reviews some improvements to the via model, covering intrinsic models for the near field of vias and the utilization of contour integral and multiple scattering methods.",

keywords = "Parallel plates, Physics-based, Power distribution network, Printed circuit board, Signal and power integrity, Vias",

author = "Renato Rimolo-Donadio and Sebastian M{\"u}ller and Xiaomin Duan and Miroslav Kotzev and Br{\"u}ns, \{Heinz D.\} and Christian Schuster",

note = "Publisher Copyright: {\textcopyright} 2012 IEEE Electromagnetic Compatibility.",

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AU - Rimolo-Donadio, Renato

AU - Müller, Sebastian

AU - Duan, Xiaomin

AU - Kotzev, Miroslav

AU - Brüns, Heinz D.

AU - Schuster, Christian

PY - 2012/3/1

Y1 - 2012/3/1

N2 - This article discusses the high-frequency behavior of thru-hole vias enclosed by solid reference planes in packages and printed circuit boards and reviews some efficient modeling alternatives for signal and power integrity applications. The electromagnetic behavior of vias, including the excitation of parallel-plate modes and the role of return vias, is introduced as preamble to the modeling approaches. The physics-based via model and its building blocks are then discussed. The last section reviews some improvements to the via model, covering intrinsic models for the near field of vias and the utilization of contour integral and multiple scattering methods.

AB - This article discusses the high-frequency behavior of thru-hole vias enclosed by solid reference planes in packages and printed circuit boards and reviews some efficient modeling alternatives for signal and power integrity applications. The electromagnetic behavior of vias, including the excitation of parallel-plate modes and the role of return vias, is introduced as preamble to the modeling approaches. The physics-based via model and its building blocks are then discussed. The last section reviews some improvements to the via model, covering intrinsic models for the near field of vias and the utilization of contour integral and multiple scattering methods.

KW - Parallel plates

KW - Physics-based

KW - Power distribution network

KW - Printed circuit board

KW - Signal and power integrity

KW - Vias

UR - https://www.scopus.com/pages/publications/84887445249

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M3 - Artículo

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SN - 2162-2264

VL - 1

SP - 55

EP - 61

JO - IEEE Electromagnetic Compatibility Magazine

JF - IEEE Electromagnetic Compatibility Magazine

ER -

Signal integrity: Efficient, physicsbased via modeling: Principles and methods

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Keywords

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