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Schnelle simulation verlustbehafteter verbindungsstrukturen auf leiterplatten auf der grundlage quasianalytischer via-modelle und der leitungstheorie

Translated title of the contribution: Quick simulation of lossy connection structures in printed circuit boards on the basis of quasi-analytical via models and the conduction theory

Research output: Chapter in Book/Report/Conference proceedingConference contributionpeer-review

5 Scopus citations
Translated title of the contributionQuick simulation of lossy connection structures in printed circuit boards on the basis of quasi-analytical via models and the conduction theory
Original languageGerman
Title of host publicationEMV 2010 - Internationale Fachmesse und Kongress fur Elektromagnetische Vertraglichkeit
StatePublished - 2010
Externally publishedYes
EventInternationale Fachmesse und Kongress fur Elektromagnetische Vertraglichkeit, EMV 2010 - International Exhibition and Conference on Electromagnetic Compatibility, EMV 2010 - Dusseldorf, Germany
Duration: 9 Mar 201011 Mar 2010

Publication series

NameEMV 2010 - Internationale Fachmesse und Kongress fur Elektromagnetische Vertraglichkeit

Conference

ConferenceInternationale Fachmesse und Kongress fur Elektromagnetische Vertraglichkeit, EMV 2010 - International Exhibition and Conference on Electromagnetic Compatibility, EMV 2010
Country/TerritoryGermany
CityDusseldorf
Period9/03/1011/03/10

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