TY - GEN
T1 - Recent developments of via and return current path modeling
AU - Muller, S.
AU - Duan, X.
AU - Rimolo-Donadio, R.
AU - Bruns, H. D.
AU - Schuster, C.
PY - 2011
Y1 - 2011
N2 - This paper reviews solutions for the modeling of vias in printed circuit boards. The focus is on two approaches: multiple scattering methods and equivalent circuit models. For each approach, the general concept is described, followed by examples of recently improved or newly developed implementations. The applicability to several kinds of via modeling tasks is summarized. Finally, a closer look is taken at the different ways of return current path modeling in the two approaches. The analysis also illustrates the frequency-dependent behavior of the return current.
AB - This paper reviews solutions for the modeling of vias in printed circuit boards. The focus is on two approaches: multiple scattering methods and equivalent circuit models. For each approach, the general concept is described, followed by examples of recently improved or newly developed implementations. The applicability to several kinds of via modeling tasks is summarized. Finally, a closer look is taken at the different ways of return current path modeling in the two approaches. The analysis also illustrates the frequency-dependent behavior of the return current.
UR - https://www.scopus.com/pages/publications/80155157818
U2 - 10.1109/ICEAA.2011.6046278
DO - 10.1109/ICEAA.2011.6046278
M3 - Contribución a la conferencia
AN - SCOPUS:80155157818
SN - 9781612849782
T3 - Proceedings - 2011 International Conference on Electromagnetics in Advanced Applications, ICEAA'11
SP - 1376
EP - 1379
BT - Proceedings - 2011 International Conference on Electromagnetics in Advanced Applications, ICEAA'11
T2 - 2011 13th International Conference on Electromagnetics in Advanced Applications, ICEAA'11
Y2 - 12 September 2011 through 16 September 2011
ER -