TY - GEN
T1 - Proximity effects between striplines and vias
AU - Kwark, Young H.
AU - Rimolo-Donadio, Renato
AU - Baks, Christian W.
AU - Muller, Sebastian
AU - Schuster, Christian
N1 - Publisher Copyright:
© 2014 IEEE.
PY - 2014/9/15
Y1 - 2014/9/15
N2 - This paper presents initial results on spurious trace-via interactions, i.e. the coupling between striplines and vias that are routed in close proximity in printed circuit boards. It is shown that the primary interaction is mediated by a capacitive coupling. Moreover, antipads of signal vias act as discontinuities in the return current path of striplines. The relevance of this effect is increased by layer misregistration in fabricated PCB laminates. For differential traces, imbalances in antipad to trace overlap margin lead to imbalances in the differential pairs, resulting in mode conversion and degradation of differential noise margins. Finally, crosstalk between striplines on different signal layers, even widely separated ones, can be mediated through capacitive coupling to and from signal vias.
AB - This paper presents initial results on spurious trace-via interactions, i.e. the coupling between striplines and vias that are routed in close proximity in printed circuit boards. It is shown that the primary interaction is mediated by a capacitive coupling. Moreover, antipads of signal vias act as discontinuities in the return current path of striplines. The relevance of this effect is increased by layer misregistration in fabricated PCB laminates. For differential traces, imbalances in antipad to trace overlap margin lead to imbalances in the differential pairs, resulting in mode conversion and degradation of differential noise margins. Finally, crosstalk between striplines on different signal layers, even widely separated ones, can be mediated through capacitive coupling to and from signal vias.
KW - Via array cross-talk
KW - via trace coupling
UR - https://www.scopus.com/pages/publications/84931837858
U2 - 10.1109/ISEMC.2014.6899049
DO - 10.1109/ISEMC.2014.6899049
M3 - Contribución a la conferencia
AN - SCOPUS:84931837858
T3 - IEEE International Symposium on Electromagnetic Compatibility
SP - 642
EP - 647
BT - 2014 IEEE International Symposium on Electromagnetic Compatibility, EMC 2014
PB - Institute of Electrical and Electronics Engineers Inc.
T2 - 2014 IEEE International Symposium on Electromagnetic Compatibility, EMC 2014
Y2 - 3 August 2014 through 8 August 2014
ER -