Preparing 25Gbps electrical I/O for exascale computing systems

Lei Shan; Young Kwark; Renato Rimolo-Donadio; Christian Baks; Michael Gaynes; Timothy Chainer

doi:10.1109/ECTC.2014.6897570

Preparing 25Gbps electrical I/O for exascale computing systems

Lei Shan
, Young Kwark
, Renato Rimolo-Donadio
, Christian Baks
, Michael Gaynes
, Timothy Chainer

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review

Abstract

This paper summarizes the exploratory work conducted at IBM Research and Zeon Corporation, which seeks to expand bandwidth and reduce power consumption of electrical I/O's for future exascale computing systems. The development of novel low-loss dielectric materials was coupled with highspeed and power scalable circuit designs to achieve 25Gbps per channel data-rate and to investigate power limits as low as 1pJ/bit at 10Gbps for aggregated parallel links. Results from test vehicles confirmed over 20% reduction in channel loss at 20GHz when compared to currently leading commercial materials, which will permit the extension of electrical link performance to meet future system requirements.

Original language	English
Title of host publication	Proceedings - Electronic Components and Technology Conference
Publisher	Institute of Electrical and Electronics Engineers Inc.
Pages	1955-1958
Number of pages	4
ISBN (Electronic)	9781479924073
DOIs	https://doi.org/10.1109/ECTC.2014.6897570
State	Published - 11 Sep 2014
Externally published	Yes
Event	64th Electronic Components and Technology Conference, ECTC 2014 - Orlando, United States Duration: 27 May 2014 → 30 May 2014

Publication series

Name	Proceedings - Electronic Components and Technology Conference
ISSN (Print)	0569-5503

Conference

Conference	64th Electronic Components and Technology Conference, ECTC 2014
Country/Territory	United States
City	Orlando
Period	27/05/14 → 30/05/14

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10.1109/ECTC.2014.6897570

Cite this

Shan, L., Kwark, Y., Rimolo-Donadio, R., Baks, C., Gaynes, M., & Chainer, T. (2014). Preparing 25Gbps electrical I/O for exascale computing systems. In Proceedings - Electronic Components and Technology Conference (pp. 1955-1958). Article 6897570 (Proceedings - Electronic Components and Technology Conference). Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1109/ECTC.2014.6897570

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title = "Preparing 25Gbps electrical I/O for exascale computing systems",

abstract = "This paper summarizes the exploratory work conducted at IBM Research and Zeon Corporation, which seeks to expand bandwidth and reduce power consumption of electrical I/O's for future exascale computing systems. The development of novel low-loss dielectric materials was coupled with highspeed and power scalable circuit designs to achieve 25Gbps per channel data-rate and to investigate power limits as low as 1pJ/bit at 10Gbps for aggregated parallel links. Results from test vehicles confirmed over 20\% reduction in channel loss at 20GHz when compared to currently leading commercial materials, which will permit the extension of electrical link performance to meet future system requirements.",

author = "Lei Shan and Young Kwark and Renato Rimolo-Donadio and Christian Baks and Michael Gaynes and Timothy Chainer",

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doi = "10.1109/ECTC.2014.6897570",

language = "Ingl{\'e}s",

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Shan, L, Kwark, Y, Rimolo-Donadio, R, Baks, C, Gaynes, M & Chainer, T 2014, Preparing 25Gbps electrical I/O for exascale computing systems. in Proceedings - Electronic Components and Technology Conference., 6897570, Proceedings - Electronic Components and Technology Conference, Institute of Electrical and Electronics Engineers Inc., pp. 1955-1958, 64th Electronic Components and Technology Conference, ECTC 2014, Orlando, United States, 27/05/14. https://doi.org/10.1109/ECTC.2014.6897570

Preparing 25Gbps electrical I/O for exascale computing systems. / Shan, Lei; Kwark, Young; Rimolo-Donadio, Renato et al.
Proceedings - Electronic Components and Technology Conference. Institute of Electrical and Electronics Engineers Inc., 2014. p. 1955-1958 6897570 (Proceedings - Electronic Components and Technology Conference).

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review

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AU - Baks, Christian

AU - Gaynes, Michael

AU - Chainer, Timothy

PY - 2014/9/11

Y1 - 2014/9/11

N2 - This paper summarizes the exploratory work conducted at IBM Research and Zeon Corporation, which seeks to expand bandwidth and reduce power consumption of electrical I/O's for future exascale computing systems. The development of novel low-loss dielectric materials was coupled with highspeed and power scalable circuit designs to achieve 25Gbps per channel data-rate and to investigate power limits as low as 1pJ/bit at 10Gbps for aggregated parallel links. Results from test vehicles confirmed over 20% reduction in channel loss at 20GHz when compared to currently leading commercial materials, which will permit the extension of electrical link performance to meet future system requirements.

AB - This paper summarizes the exploratory work conducted at IBM Research and Zeon Corporation, which seeks to expand bandwidth and reduce power consumption of electrical I/O's for future exascale computing systems. The development of novel low-loss dielectric materials was coupled with highspeed and power scalable circuit designs to achieve 25Gbps per channel data-rate and to investigate power limits as low as 1pJ/bit at 10Gbps for aggregated parallel links. Results from test vehicles confirmed over 20% reduction in channel loss at 20GHz when compared to currently leading commercial materials, which will permit the extension of electrical link performance to meet future system requirements.

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DO - 10.1109/ECTC.2014.6897570

M3 - Contribución a la conferencia

AN - SCOPUS:84907901262

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BT - Proceedings - Electronic Components and Technology Conference

PB - Institute of Electrical and Electronics Engineers Inc.

T2 - 64th Electronic Components and Technology Conference, ECTC 2014

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ER -

Shan L, Kwark Y, Rimolo-Donadio R, Baks C, Gaynes M, Chainer T. Preparing 25Gbps electrical I/O for exascale computing systems. In Proceedings - Electronic Components and Technology Conference. Institute of Electrical and Electronics Engineers Inc. 2014. p. 1955-1958. 6897570. (Proceedings - Electronic Components and Technology Conference). doi: 10.1109/ECTC.2014.6897570

Preparing 25Gbps electrical I/O for exascale computing systems

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