TY - GEN
T1 - Mode Conversion Due to Residual Via Stubs in Differential Signaling
AU - Cedeño-Chaves, Jonathan
AU - Scharff, Katharina
AU - Carmona-Cruz, Allan
AU - Brüns, Heinz Dietrich
AU - Rimolo-Donadio, Renato
AU - Schuster, Christian
N1 - Publisher Copyright:
© 2019 IEEE.
PY - 2019/6
Y1 - 2019/6
N2 - Mode conversion is an important source of degradation in differential links, which can be induced by a trace length mismatch or asymmetric ground via configurations. This paper explores another source of mode conversion caused by asymmetric residual via stubs. These remnant via stubs can be present because of multiple reasons, such as residual stubs due to process tolerances or errors during back-drilling. Different via configurations have been analyzed through full-wave simulations. Results show a large impact on mode conversion with an increment of around -35 and -15 dB when the residual stub difference changes from 2 to 14 mil at the fundamental frequency of 17.5 GHz. Furthermore, an estimation approach of mode conversion as a function of via stub asymmetry is proposed.
AB - Mode conversion is an important source of degradation in differential links, which can be induced by a trace length mismatch or asymmetric ground via configurations. This paper explores another source of mode conversion caused by asymmetric residual via stubs. These remnant via stubs can be present because of multiple reasons, such as residual stubs due to process tolerances or errors during back-drilling. Different via configurations have been analyzed through full-wave simulations. Results show a large impact on mode conversion with an increment of around -35 and -15 dB when the residual stub difference changes from 2 to 14 mil at the fundamental frequency of 17.5 GHz. Furthermore, an estimation approach of mode conversion as a function of via stub asymmetry is proposed.
KW - Back-drilling
KW - differential signaling
KW - mode conversion
KW - printed circuit board
KW - signal integrity
KW - via stub
UR - https://www.scopus.com/pages/publications/85070857205
U2 - 10.1109/SaPIW.2019.8781665
DO - 10.1109/SaPIW.2019.8781665
M3 - Contribución a la conferencia
AN - SCOPUS:85070857205
T3 - 2019 IEEE 23rd Workshop on Signal and Power Integrity, SPI 2019 - Proceedings
BT - 2019 IEEE 23rd Workshop on Signal and Power Integrity, SPI 2019 - Proceedings
PB - Institute of Electrical and Electronics Engineers Inc.
T2 - 23rd IEEE Workshop on Signal and Power Integrity, SPI 2019
Y2 - 18 June 2019 through 21 June 2019
ER -