TY - GEN
T1 - High-speed signaling performance of multilevel wiring on glass substrates for 2.5-D integrated circuit and optoelectronic integration
AU - Gu, Xiaoxiong
AU - Rimolo-Donadio, Renato
AU - Budd, Russell
AU - Baks, Christian W.
AU - Turlapati, Lavanya
AU - Jahnes, Christopher
AU - Kuchta, Daniel M.
AU - Schow, Clint L.
AU - Libsch, Frank
PY - 2013
Y1 - 2013
N2 - This paper reports on the evaluation of high-speed signaling performance of multilevel metallic interconnects on glass substrates. The wafer fabrication, transfer process, and passive electrical characterization of interconnects are addressed. Measurement results demonstrate less than 5 dB/cm insertion loss below 20 GHz. Moreover, 2-level wiring on glass with inter-level vias is utilized to implement 3.6-mm long transmission lines that connect high-speed transceivers and optoelectronic devices in a VCSEL-based optoelectronic fiber link. The relative performances of diverse configurations with and without wiring on glass are compared. Error-free link operation at a bit-error-rate (BER) of 10-12 is demonstrated up to 30 Gb/s with ∼3 dB sensitivity penalty for the link with glass carrier transmission lines.
AB - This paper reports on the evaluation of high-speed signaling performance of multilevel metallic interconnects on glass substrates. The wafer fabrication, transfer process, and passive electrical characterization of interconnects are addressed. Measurement results demonstrate less than 5 dB/cm insertion loss below 20 GHz. Moreover, 2-level wiring on glass with inter-level vias is utilized to implement 3.6-mm long transmission lines that connect high-speed transceivers and optoelectronic devices in a VCSEL-based optoelectronic fiber link. The relative performances of diverse configurations with and without wiring on glass are compared. Error-free link operation at a bit-error-rate (BER) of 10-12 is demonstrated up to 30 Gb/s with ∼3 dB sensitivity penalty for the link with glass carrier transmission lines.
UR - https://www.scopus.com/pages/publications/84883397655
U2 - 10.1109/ECTC.2013.6575672
DO - 10.1109/ECTC.2013.6575672
M3 - Contribución a la conferencia
AN - SCOPUS:84883397655
SN - 9781479902330
T3 - Proceedings - Electronic Components and Technology Conference
SP - 846
EP - 851
BT - 2013 IEEE 63rd Electronic Components and Technology Conference, ECTC 2013
T2 - 2013 IEEE 63rd Electronic Components and Technology Conference, ECTC 2013
Y2 - 28 May 2013 through 31 May 2013
ER -