Fast parametric pre-layout analysis of signal integrity for backplane interconnects

Renato Rimolo-Donadio; Thomas Michael Winkel; Claudio Siviero; Dierk Kaller; Hubert Harrer; Heinz Dietrich Bruns; Christian Schuster

doi:10.1109/SPI.2011.5898839

Fast parametric pre-layout analysis of signal integrity for backplane interconnects

Renato Rimolo-Donadio
, Thomas Michael Winkel
, Claudio Siviero
, Dierk Kaller
, Hubert Harrer
, Heinz Dietrich Bruns
, Christian Schuster

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review

2 Scopus citations

Abstract

The effective design of passive interconnect links in a pre-layout phase may be a challenging task that involve multidimensional trade-off analyses to find an optimum between system performance and cost. Highly efficient interconnect models can be used to assist this process by allowing a detailed exploration of the design space and the impact of different alternatives in an early stage. This paper addresses this issue by proposing a parametric and automated framework for analysis of single-ended links across multiple substrates with semi-analytical via and trace models. It is shown that this method can provide rapid estimations (second to minute range) and it is suitable for the analysis of configurations with realistic complexity.

Original language	English
Title of host publication	2011 IEEE 15th Workshop on Signal Propagation on Interconnects, SPI 2011 - Proceedings
Pages	51-54
Number of pages	4
DOIs	https://doi.org/10.1109/SPI.2011.5898839
State	Published - 2011
Externally published	Yes
Event	2011 IEEE 15th Workshop on Signal Propagation on Interconnects, SPI 2011 - Naples, Italy Duration: 8 May 2011 → 11 May 2011

Publication series

Name	2011 IEEE 15th Workshop on Signal Propagation on Interconnects, SPI 2011 - Proceedings

Conference

Conference	2011 IEEE 15th Workshop on Signal Propagation on Interconnects, SPI 2011
Country/Territory	Italy
City	Naples
Period	8/05/11 → 11/05/11

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10.1109/SPI.2011.5898839

Cite this

Rimolo-Donadio, R., Winkel, T. M., Siviero, C., Kaller, D., Harrer, H., Bruns, H. D., & Schuster, C. (2011). Fast parametric pre-layout analysis of signal integrity for backplane interconnects. In 2011 IEEE 15th Workshop on Signal Propagation on Interconnects, SPI 2011 - Proceedings (pp. 51-54). Article 5898839 (2011 IEEE 15th Workshop on Signal Propagation on Interconnects, SPI 2011 - Proceedings). https://doi.org/10.1109/SPI.2011.5898839

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title = "Fast parametric pre-layout analysis of signal integrity for backplane interconnects",

abstract = "The effective design of passive interconnect links in a pre-layout phase may be a challenging task that involve multidimensional trade-off analyses to find an optimum between system performance and cost. Highly efficient interconnect models can be used to assist this process by allowing a detailed exploration of the design space and the impact of different alternatives in an early stage. This paper addresses this issue by proposing a parametric and automated framework for analysis of single-ended links across multiple substrates with semi-analytical via and trace models. It is shown that this method can provide rapid estimations (second to minute range) and it is suitable for the analysis of configurations with realistic complexity.",

author = "Renato Rimolo-Donadio and Winkel, \{Thomas Michael\} and Claudio Siviero and Dierk Kaller and Hubert Harrer and Bruns, \{Heinz Dietrich\} and Christian Schuster",

year = "2011",

doi = "10.1109/SPI.2011.5898839",

language = "Ingl{\'e}s",

isbn = "9781457704673",

series = "2011 IEEE 15th Workshop on Signal Propagation on Interconnects, SPI 2011 - Proceedings",

pages = "51--54",

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note = "2011 IEEE 15th Workshop on Signal Propagation on Interconnects, SPI 2011 ; Conference date: 08-05-2011 Through 11-05-2011",

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Rimolo-Donadio, R, Winkel, TM, Siviero, C, Kaller, D, Harrer, H, Bruns, HD & Schuster, C 2011, Fast parametric pre-layout analysis of signal integrity for backplane interconnects. in 2011 IEEE 15th Workshop on Signal Propagation on Interconnects, SPI 2011 - Proceedings., 5898839, 2011 IEEE 15th Workshop on Signal Propagation on Interconnects, SPI 2011 - Proceedings, pp. 51-54, 2011 IEEE 15th Workshop on Signal Propagation on Interconnects, SPI 2011, Naples, Italy, 8/05/11. https://doi.org/10.1109/SPI.2011.5898839

Fast parametric pre-layout analysis of signal integrity for backplane interconnects. / Rimolo-Donadio, Renato; Winkel, Thomas Michael; Siviero, Claudio et al.
2011 IEEE 15th Workshop on Signal Propagation on Interconnects, SPI 2011 - Proceedings. 2011. p. 51-54 5898839 (2011 IEEE 15th Workshop on Signal Propagation on Interconnects, SPI 2011 - Proceedings).

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review

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AU - Rimolo-Donadio, Renato

AU - Winkel, Thomas Michael

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AU - Harrer, Hubert

AU - Bruns, Heinz Dietrich

AU - Schuster, Christian

PY - 2011

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N2 - The effective design of passive interconnect links in a pre-layout phase may be a challenging task that involve multidimensional trade-off analyses to find an optimum between system performance and cost. Highly efficient interconnect models can be used to assist this process by allowing a detailed exploration of the design space and the impact of different alternatives in an early stage. This paper addresses this issue by proposing a parametric and automated framework for analysis of single-ended links across multiple substrates with semi-analytical via and trace models. It is shown that this method can provide rapid estimations (second to minute range) and it is suitable for the analysis of configurations with realistic complexity.

AB - The effective design of passive interconnect links in a pre-layout phase may be a challenging task that involve multidimensional trade-off analyses to find an optimum between system performance and cost. Highly efficient interconnect models can be used to assist this process by allowing a detailed exploration of the design space and the impact of different alternatives in an early stage. This paper addresses this issue by proposing a parametric and automated framework for analysis of single-ended links across multiple substrates with semi-analytical via and trace models. It is shown that this method can provide rapid estimations (second to minute range) and it is suitable for the analysis of configurations with realistic complexity.

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M3 - Contribución a la conferencia

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T3 - 2011 IEEE 15th Workshop on Signal Propagation on Interconnects, SPI 2011 - Proceedings

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BT - 2011 IEEE 15th Workshop on Signal Propagation on Interconnects, SPI 2011 - Proceedings

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ER -

Rimolo-Donadio R, Winkel TM, Siviero C, Kaller D, Harrer H, Bruns HD et al. Fast parametric pre-layout analysis of signal integrity for backplane interconnects. In 2011 IEEE 15th Workshop on Signal Propagation on Interconnects, SPI 2011 - Proceedings. 2011. p. 51-54. 5898839. (2011 IEEE 15th Workshop on Signal Propagation on Interconnects, SPI 2011 - Proceedings). doi: 10.1109/SPI.2011.5898839

Fast parametric pre-layout analysis of signal integrity for backplane interconnects

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