Fast and concurrent simulations for SI, PI, and EMI analysis of multilayer printed circuit boards

In previous work of the authors, a hybridization of four efficient techniques, namely the physics-based via model, the modal decomposition technique, the contour integral method, and the field equivalence principle, has been proposed for fast and concurrent analysis of signal integrity (SI), power integrity (PI), and electromagnetic interference (EMI) effects on printed circuit boards (PCBs). This paper focuses on the application of the method to simulate multilayer PCBs. An application example is demonstrated and the results with respect to SI, PI and EMI analysis, including S-parameter, field distributions between power planes, as well as radiated power, are discussed. Full-wave simulation results are also provided for comparison and validation. It is shown that the combined method is more than one hundred times faster than general purpose full-wave solvers.