Extraction of via-plate capacitance of an eccentric via by an integral approximation method

Yaojiang Zhang; Renato Rimolo-Donadio; Jun Fan; Christian Schuster; Erping Li

doi:10.1109/LMWC.2009.2017587

Extraction of via-plate capacitance of an eccentric via by an integral approximation method

Yaojiang Zhang
, Renato Rimolo-Donadio
, Jun Fan
, Christian Schuster
, Erping Li

Research output: Contribution to journal › Article › peer-review

7 Scopus citations

Abstract

An integral approximation method is proposed to extract the via-plate capacitance of an eccentric via in the via hole (anti-pad). An analytical formula is derived for the coaxial capacitance part, which is used as a benchmark to validate the integral approximation method. Furthermore, numerical simulations are also used to validate the method. It is shown that small eccentricity results in only a few percentage increase of the via-plate capacitance, which is helpful in specifying the manufacturing tolerance of via designs.

Original language	English
Article number	4840543
Pages (from-to)	275-277
Number of pages	3
Journal	IEEE Microwave and Wireless Components Letters
Volume	19
Issue number	5
DOIs	https://doi.org/10.1109/LMWC.2009.2017587
State	Published - May 2009
Externally published	Yes

Keywords

Eccentric vias
Printed circuit board (PCB)
Signal integrity (SI)
Via-plate capacitance

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10.1109/LMWC.2009.2017587

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title = "Extraction of via-plate capacitance of an eccentric via by an integral approximation method",

abstract = "An integral approximation method is proposed to extract the via-plate capacitance of an eccentric via in the via hole (anti-pad). An analytical formula is derived for the coaxial capacitance part, which is used as a benchmark to validate the integral approximation method. Furthermore, numerical simulations are also used to validate the method. It is shown that small eccentricity results in only a few percentage increase of the via-plate capacitance, which is helpful in specifying the manufacturing tolerance of via designs.",

keywords = "Eccentric vias, Printed circuit board (PCB), Signal integrity (SI), Via-plate capacitance",

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AU - Zhang, Yaojiang

AU - Rimolo-Donadio, Renato

AU - Fan, Jun

AU - Schuster, Christian

AU - Li, Erping

PY - 2009/5

Y1 - 2009/5

N2 - An integral approximation method is proposed to extract the via-plate capacitance of an eccentric via in the via hole (anti-pad). An analytical formula is derived for the coaxial capacitance part, which is used as a benchmark to validate the integral approximation method. Furthermore, numerical simulations are also used to validate the method. It is shown that small eccentricity results in only a few percentage increase of the via-plate capacitance, which is helpful in specifying the manufacturing tolerance of via designs.

AB - An integral approximation method is proposed to extract the via-plate capacitance of an eccentric via in the via hole (anti-pad). An analytical formula is derived for the coaxial capacitance part, which is used as a benchmark to validate the integral approximation method. Furthermore, numerical simulations are also used to validate the method. It is shown that small eccentricity results in only a few percentage increase of the via-plate capacitance, which is helpful in specifying the manufacturing tolerance of via designs.

KW - Eccentric vias

KW - Printed circuit board (PCB)

KW - Signal integrity (SI)

KW - Via-plate capacitance

UR - https://www.scopus.com/pages/publications/67649233104

U2 - 10.1109/LMWC.2009.2017587

DO - 10.1109/LMWC.2009.2017587

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JF - IEEE Microwave and Wireless Components Letters

IS - 5

M1 - 4840543

ER -

Extraction of via-plate capacitance of an eccentric via by an integral approximation method

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Keywords

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