TY - GEN
T1 - Experimental validation of an 8 GHz EBG based common mode filter and impact of manufacturing uncertainties
AU - De Paulis, Francesco
AU - Nisanci, Muhammet Hilmi
AU - Orlandi, Antonio
AU - Gu, Xiaoxiong
AU - Rimolo-Donadio, Renato
AU - Baks, Christian
AU - Kwark, Young
AU - Archambeault, Bruce
AU - Connor, Sam
PY - 2013
Y1 - 2013
N2 - Common mode noise associated to the differential signal propagation represents a major concern for crosstalk and EMI issues. The common mode filter based on electromagnetic band-gap (EBG) structures have been shown to be cost effective and easy to design, since they are made using the standard PCB technology. The coupling between the differential interconnect and the EBG cavity converts the energy associated to the common mode into the cavity resonant mode, thus reducing the common mode noise reaching the receiver. A simple design procedure is reviewed in this paper for a quick design, and it is applied to a 8 GHz filter. The filter is then manufactured on a 6 layer PCB and its performances are investigated through measurements both in frequency and time domain. The filter topology as well as the design procedure are validated through model-to-hardware correlation.
AB - Common mode noise associated to the differential signal propagation represents a major concern for crosstalk and EMI issues. The common mode filter based on electromagnetic band-gap (EBG) structures have been shown to be cost effective and easy to design, since they are made using the standard PCB technology. The coupling between the differential interconnect and the EBG cavity converts the energy associated to the common mode into the cavity resonant mode, thus reducing the common mode noise reaching the receiver. A simple design procedure is reviewed in this paper for a quick design, and it is applied to a 8 GHz filter. The filter is then manufactured on a 6 layer PCB and its performances are investigated through measurements both in frequency and time domain. The filter topology as well as the design procedure are validated through model-to-hardware correlation.
UR - https://www.scopus.com/pages/publications/84893174661
U2 - 10.1109/ISEMC.2013.6670376
DO - 10.1109/ISEMC.2013.6670376
M3 - Contribución a la conferencia
AN - SCOPUS:84893174661
SN - 9781479904082
T3 - IEEE International Symposium on Electromagnetic Compatibility
SP - 27
EP - 32
BT - Proceedings - 2013 IEEE International Symposium on Electromagnetic Compatibility, EMC 2013
T2 - 2013 IEEE International Symposium on Electromagnetic Compatibility, EMC 2013
Y2 - 5 August 2013 through 9 August 2013
ER -