Evaluation of concatenation techniques for state-space interconnect macromodels

Luis Ernesto Carrera-Retana; Renato Rimolo-Donadio; Christian Schuster

doi:10.1109/EPEPS.2017.8329728

Evaluation of concatenation techniques for state-space interconnect macromodels

Luis Ernesto Carrera-Retana
, Renato Rimolo-Donadio
, Christian Schuster

Escuela de Ingeniería Electrónica

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review

3 Scopus citations

Abstract

In this work, we show that concatenating inter-connect models represented in state-space (descriptor) form, obtained from either the vector fitting algorithm or the Loewner matrix pencil method, can provide results as accurate as usual concatenation using sampled frequency domain data. A PCB-based interconnect is used as an example.

Original language	English
Title of host publication	2017 IEEE 26th Conference on Electrical Performance of Electronic Packaging and Systems, EPEPS 2017
Publisher	Institute of Electrical and Electronics Engineers Inc.
Pages	1-3
Number of pages	3
ISBN (Electronic)	9781467364836
DOIs	https://doi.org/10.1109/EPEPS.2017.8329728
State	Published - 2 Jul 2017
Event	26th IEEE Conference on Electrical Performance of Electronic Packaging and Systems, EPEPS 2017 - San Jose, United States Duration: 15 Oct 2017 → 18 Oct 2017

Publication series

Name	2017 IEEE 26th Conference on Electrical Performance of Electronic Packaging and Systems, EPEPS 2017
Volume	2018-January

Conference

Conference	26th IEEE Conference on Electrical Performance of Electronic Packaging and Systems, EPEPS 2017
Country/Territory	United States
City	San Jose
Period	15/10/17 → 18/10/17

Keywords

Macromodeling
on-chip inter-connect simulation
signal integrity

Access to Document

10.1109/EPEPS.2017.8329728

Cite this

Carrera-Retana, L. E., Rimolo-Donadio, R., & Schuster, C. (2017). Evaluation of concatenation techniques for state-space interconnect macromodels. In 2017 IEEE 26th Conference on Electrical Performance of Electronic Packaging and Systems, EPEPS 2017 (pp. 1-3). (2017 IEEE 26th Conference on Electrical Performance of Electronic Packaging and Systems, EPEPS 2017; Vol. 2018-January). Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1109/EPEPS.2017.8329728

Carrera-Retana, Luis Ernesto ; Rimolo-Donadio, Renato ; Schuster, Christian. / Evaluation of concatenation techniques for state-space interconnect macromodels. 2017 IEEE 26th Conference on Electrical Performance of Electronic Packaging and Systems, EPEPS 2017. Institute of Electrical and Electronics Engineers Inc., 2017. pp. 1-3 (2017 IEEE 26th Conference on Electrical Performance of Electronic Packaging and Systems, EPEPS 2017).

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abstract = "In this work, we show that concatenating inter-connect models represented in state-space (descriptor) form, obtained from either the vector fitting algorithm or the Loewner matrix pencil method, can provide results as accurate as usual concatenation using sampled frequency domain data. A PCB-based interconnect is used as an example.",

keywords = "Macromodeling, on-chip inter-connect simulation, signal integrity",

author = "Carrera-Retana, \{Luis Ernesto\} and Renato Rimolo-Donadio and Christian Schuster",

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Carrera-Retana, LE, Rimolo-Donadio, R & Schuster, C 2017, Evaluation of concatenation techniques for state-space interconnect macromodels. in 2017 IEEE 26th Conference on Electrical Performance of Electronic Packaging and Systems, EPEPS 2017. 2017 IEEE 26th Conference on Electrical Performance of Electronic Packaging and Systems, EPEPS 2017, vol. 2018-January, Institute of Electrical and Electronics Engineers Inc., pp. 1-3, 26th IEEE Conference on Electrical Performance of Electronic Packaging and Systems, EPEPS 2017, San Jose, United States, 15/10/17. https://doi.org/10.1109/EPEPS.2017.8329728

Evaluation of concatenation techniques for state-space interconnect macromodels. / Carrera-Retana, Luis Ernesto; Rimolo-Donadio, Renato; Schuster, Christian.
2017 IEEE 26th Conference on Electrical Performance of Electronic Packaging and Systems, EPEPS 2017. Institute of Electrical and Electronics Engineers Inc., 2017. p. 1-3 (2017 IEEE 26th Conference on Electrical Performance of Electronic Packaging and Systems, EPEPS 2017; Vol. 2018-January).

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review

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AU - Rimolo-Donadio, Renato

AU - Schuster, Christian

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AB - In this work, we show that concatenating inter-connect models represented in state-space (descriptor) form, obtained from either the vector fitting algorithm or the Loewner matrix pencil method, can provide results as accurate as usual concatenation using sampled frequency domain data. A PCB-based interconnect is used as an example.

KW - Macromodeling

KW - on-chip inter-connect simulation

KW - signal integrity

UR - https://www.scopus.com/pages/publications/85049759065

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PB - Institute of Electrical and Electronics Engineers Inc.

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Y2 - 15 October 2017 through 18 October 2017

ER -

Carrera-Retana LE, Rimolo-Donadio R, Schuster C. Evaluation of concatenation techniques for state-space interconnect macromodels. In 2017 IEEE 26th Conference on Electrical Performance of Electronic Packaging and Systems, EPEPS 2017. Institute of Electrical and Electronics Engineers Inc. 2017. p. 1-3. (2017 IEEE 26th Conference on Electrical Performance of Electronic Packaging and Systems, EPEPS 2017). doi: 10.1109/EPEPS.2017.8329728

Evaluation of concatenation techniques for state-space interconnect macromodels

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