TY - GEN
T1 - Double stub matching in multilayered printed circuit board using vias
AU - Hardock, Andreas
AU - Rimolo-Donadio, Renato
AU - Brüns, Heinz Dietrich
AU - Schuster, Christian
PY - 2012
Y1 - 2012
N2 - In this paper the authors present the application of functional vias to narrowband load matching in the frequency range from 2 up to 20 GHz. The utilization of single and double stub matching is demonstrated. Corresponding network parts basically contain one or two via stubs and transmission line elements, e. g. striplines and microstrips. It is also shown that in most of the given frequency range vias and via stubs can be characterized as transmission lines. Especially the influence of the via configuration on the characteristic impedance and the propagation constant are analyzed in order to investigate their feasibility for matching purposes. Influences are the via length, the number of adjacent ground vias and their distance to the signal via. The analysis is done for open and shorted vias and is based on measurements, full-wave simulations and physics-based via models. Examples include matching networks with inductive loads up to several nH.
AB - In this paper the authors present the application of functional vias to narrowband load matching in the frequency range from 2 up to 20 GHz. The utilization of single and double stub matching is demonstrated. Corresponding network parts basically contain one or two via stubs and transmission line elements, e. g. striplines and microstrips. It is also shown that in most of the given frequency range vias and via stubs can be characterized as transmission lines. Especially the influence of the via configuration on the characteristic impedance and the propagation constant are analyzed in order to investigate their feasibility for matching purposes. Influences are the via length, the number of adjacent ground vias and their distance to the signal via. The analysis is done for open and shorted vias and is based on measurements, full-wave simulations and physics-based via models. Examples include matching networks with inductive loads up to several nH.
UR - https://www.scopus.com/pages/publications/84866876720
U2 - 10.1109/ECTC.2012.6249124
DO - 10.1109/ECTC.2012.6249124
M3 - Contribución a la conferencia
AN - SCOPUS:84866876720
SN - 9781467319669
T3 - Proceedings - Electronic Components and Technology Conference
SP - 2057
EP - 2061
BT - 2012 IEEE 62nd Electronic Components and Technology Conference, ECTC 2012
T2 - 2012 IEEE 62nd Electronic Components and Technology Conference, ECTC 2012
Y2 - 29 May 2012 through 1 June 2012
ER -