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Anwendung quasianalytischer Via-Modelle zur schnellen Simulation dichter Via-Arrays

Translated title of the contribution: Use of quasi-analytic via models for rapid simulation of dense via arrays
  • Hamburg University of Technology

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review

Translated title of the contributionUse of quasi-analytic via models for rapid simulation of dense via arrays
Original languageGerman
Title of host publicationElektromagnetische Vertraglichkeit, EMV 2012
Subtitle of host publicationInternationale Fachmesse und Kongress fur Elektromagnetische Vertraglichkeit
Pages421-428
Number of pages8
StatePublished - 2012
Externally publishedYes
EventInternationale Fachmesse und Kongress fur Elektromagnetische Vertraglichkeit, EMV 2012 - International Exhibition and Conference on Electromagnetic Compatibility, EMV 2012 - Dusseldorf, Germany
Duration: 7 Feb 2012 → 9 Feb 2012

Publication series

NameElektromagnetische Vertraglichkeit, EMV 2012: Internationale Fachmesse und Kongress fur Elektromagnetische Vertraglichkeit

Conference

ConferenceInternationale Fachmesse und Kongress fur Elektromagnetische Vertraglichkeit, EMV 2012 - International Exhibition and Conference on Electromagnetic Compatibility, EMV 2012
Country/TerritoryGermany
CityDusseldorf
Period7/02/12 → 9/02/12

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